Description
Engineering-grade PC filament | High impact and heat resistance | Smooth, lustrous surface finish | 1kg spool
The Anycubic PC Filament is an engineering-grade polycarbonate filament designed for makers and engineers who need parts that go beyond what standard PLA or ABS can offer. Compatible with FDM printers fitted with a nozzle of 0.2 mm or above, it prints at 270–290°C with a heated bed of 100–120°C, and supports print speeds of 40–250 mm/s. With a heat deflection temperature of 110°C and strong mechanical properties — including a tensile strength of 65±6 MPa and an Izod impact strength of 30±12 kJ/m² — it is well suited to structural parts, functional components, automotive applications, electronic housings, and outdoor use. The filament also delivers smooth model surfaces with a translucent, lustrous quality. Note that active drying is required before printing: 80°C for 8–12 hours. Supplied on a 1kg reusable spool with intelligent identification chip support for compatible Anycubic printers.
Features
- Engineering-grade PC filament for structural, functional, and outdoor applications
- Heat deflection temperature of 110°C — resists warping and deformation under prolonged heat
- Izod impact strength of 30±12 kJ/m² (X-Y) for tough, crack-resistant parts
- Tensile strength of 65±6 MPa and bending strength of 105±10 MPa
- Smooth, translucent, and lustrous surface finish
- Intelligent identification chip supported for compatible Anycubic printers
- Reusable spool with threaded connection system to reduce filament entanglement
- Active drying required before use: 80°C for 8–12 hours
Specifications
- Colour: White (#FFFFFF)
- Dry Out Before Use: Required
- Drying Condition: 80 ℃, 8-12 h
- ACE Compatibility: Compatible
- Nozzle Size: Recommended 0.2 mm or above
- Printing Temperature: 270-290 ℃
- Heated Bed Temperature: 100-120 ℃
- Recommended Printing Speed: 40-250 mm/s
- Maximum Volume Speed (Flow Rate): 12 mm³/s
- Density: 1.2 g/cm³
- Melt Index: 15-20 g/10 min (270℃/1.2kg)
- Melting Point Temperature: 230 ℃
- Vicat Softening Temperature: 122 ℃
- Heat Deflection Temperature (0.45MPa): 110 ℃
- Young’s Modulus: 2550±100 MPa
- Tensile Strength: 65±6 MPa
- Elongation at Break: 9±4%
- Bending Modulus: 2900±150 MPa
- Bending Strength: 105±10 MPa
- lzod lmpact Strength (X-Y): 30±12 kJ/m²
- Tensile Strength (Z): 25±7 MPa
- Filament Type: Engineering filaments
- Recommend to Print: Structural parts, functional parts, automotive parts, outdoor use, electronic housing, artworks
- Intelligent Identification: Supported
- Reusable Filament Spool: Supported
What’s in the Box
- Anycubic PC Filament 1kg – White x1
Antec FLUX Rear ARGB ATX Mid Tower Gaming Chassis - Black
Xiaomi Multifunctional Flash Light
UGREEN USB 3.0 Male to Type-C 3.1 Female Adapter, Data Transfer and Charging
Xiaomi Bluetooth Speaker Mini, 6W, RGB, IP67, 11H Battery
Xiaomi Uniblade Trimmer Replacement Head
Gizzu 1080P HDMI to VGA Adapter Poly
Xiaomi Sound Play Speaker 18W - White
Xiaomi Window and Door Sensor 2
Gizzu 8K DisplayPort Cable 2m Poly
Antec C5 CURVED ARGB ATX | Micro-ATX | ITX ARGB Dual Chamber Mid-Tower Gaming Chassis - White
Keychron C3 Pro QMK/VIA Wired Mechanical Keyboard (80% Layout, Red Switches, ABS Keycaps)
Antec FLUX SE E-ATX | ATX | Micro-ATX | ITX Mid-Tower Gaming Chassis Wood Front Panel- Black
UGREEN LP121 Cable Protection Tube 25mm x 3M - Black
Antec CX200M Elite Micro-ATX | ITX RGB Mini-Tower Gaming Chassis - Black
Xiaomi Flexible Rechargeable Lamp
Gizzu 1080P DisplayPort to VGA Cable 1.8m Poly
UGREEN Bluetooth 5.4 USB Adapter
Antec C2M ARGB Compact Micro-ATX Gaming Chassis - Black
GIZZU 4K HDMI 2.0 CABLE 20M POLY
UGREEN FineTrack Mini Smart Finder for Apple Devices 




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