Description
Engineering-grade PC filament | High impact and heat resistance | Smooth, lustrous surface finish | 1kg spool
The Anycubic PC Filament is an engineering-grade polycarbonate filament designed for makers and engineers who need parts that go beyond what standard PLA or ABS can offer. Compatible with FDM printers fitted with a nozzle of 0.2 mm or above, it prints at 270–290°C with a heated bed of 100–120°C, and supports print speeds of 40–250 mm/s. With a heat deflection temperature of 110°C and strong mechanical properties — including a tensile strength of 65±6 MPa and an Izod impact strength of 30±12 kJ/m² — it is well suited to structural parts, functional components, automotive applications, electronic housings, and outdoor use. The filament also delivers smooth model surfaces with a translucent, lustrous quality. Note that active drying is required before printing: 80°C for 8–12 hours. Supplied on a 1kg reusable spool with intelligent identification chip support for compatible Anycubic printers.
Features
- Engineering-grade PC filament for structural, functional, and outdoor applications
- Heat deflection temperature of 110°C — resists warping and deformation under prolonged heat
- Izod impact strength of 30±12 kJ/m² (X-Y) for tough, crack-resistant parts
- Tensile strength of 65±6 MPa and bending strength of 105±10 MPa
- Smooth, translucent, and lustrous surface finish
- Intelligent identification chip supported for compatible Anycubic printers
- Reusable spool with threaded connection system to reduce filament entanglement
- Active drying required before use: 80°C for 8–12 hours
Specifications
- Colour: White (#FFFFFF)
- Dry Out Before Use: Required
- Drying Condition: 80 ℃, 8-12 h
- ACE Compatibility: Compatible
- Nozzle Size: Recommended 0.2 mm or above
- Printing Temperature: 270-290 ℃
- Heated Bed Temperature: 100-120 ℃
- Recommended Printing Speed: 40-250 mm/s
- Maximum Volume Speed (Flow Rate): 12 mm³/s
- Density: 1.2 g/cm³
- Melt Index: 15-20 g/10 min (270℃/1.2kg)
- Melting Point Temperature: 230 ℃
- Vicat Softening Temperature: 122 ℃
- Heat Deflection Temperature (0.45MPa): 110 ℃
- Young’s Modulus: 2550±100 MPa
- Tensile Strength: 65±6 MPa
- Elongation at Break: 9±4%
- Bending Modulus: 2900±150 MPa
- Bending Strength: 105±10 MPa
- lzod lmpact Strength (X-Y): 30±12 kJ/m²
- Tensile Strength (Z): 25±7 MPa
- Filament Type: Engineering filaments
- Recommend to Print: Structural parts, functional parts, automotive parts, outdoor use, electronic housing, artworks
- Intelligent Identification: Supported
- Reusable Filament Spool: Supported
What’s in the Box
- Anycubic PC Filament 1kg – White x1
GeIL Pristine 16GB DDR5 5600MHz Notebook Memory
Hiksemi Future RGB 16GBKIT (2x8GB) 3600MHz DDR4 Desktop Gaming Memory Black
HIKSEMI Future RGB 8GB 3600MHz DDR4 UDIMM Gaming Memory – Black
GeIL Pristine 32GB DDR4 3200MHz UDIMM Desktop Memory
GeIL Pristine 4GB DDR4 2666MHz SODIMM Notebook Memory
Intel Ultra 5 250KF PLUS 4.2GHz LGA1851 18-core CPU
HIKSEMI WAVE(S) 2.5" 256GB SATAIII SSD
Intel® Core Ultra 5 225F LGA1851 3.30GHz 10-Core CPU
Patriot P220 1TB 2.5" SSD
Intel 14th Gen Core i5-14400 LGA1700 2.5GHz 6-Core CPU
Intel Core i7-14700 LGA1700 2.1GHz 20-Core Processor
Intel Ultra 5 250K 4.2GHz LGA1851 18-core CPU
AMD Ryzen 5 3400G 4-Core 3.7GHz AM4 CPU
Hiksemi City Series E100 2TB 2.5" SATAIII SSD
Patriot P220 2TB 2.5" SSD
AMD RYZEN 5 4500 6-Core 3.8 GHZ AM4 CPU
Geil Orion RGB 16GB KIT(2X8GB) 3600MHz DDR4 Desktop Gaming Memory - Grey
AMD RYZEN 7 5700X 8-Core 3.4GHz AM4 CPU
AMD RYZEN 7 5700G 8-Core 4.6GHZ AM4 CPU
GeIL Pristine 8GB DDR4 3200MHz Desktop Memory
AMD RYZEN 5 9600X 6-Core 3.9GHz AM5 CPU
Hiksemi Hiker 32GB DDR4 3200MHz Desktop Memory
AMD RYZEN 5 7400 6-Core 3.3GHz AM5 CPU 




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